Growing evidence indicates Huawei is constructing proprietary DRAM fabs, based on multiple media reports and analysis from Citrini’s Jukan and TriOrient Investments’ Dan Nystedt posted on X.
Global DRAM and HBM supplies face severe shortages, driven by Nvidia’s surging HBM demand for AI GPU servers deployed at hyperscalers, cloud firms and enterprises for foundation model training and inference. GPU servers require supporting DRAM, while rival AI chipmakers AMD and Intel further boost market consumption. Widespread LLM adoption starting with ChatGPT in 2022 triggered this AI-fueled demand spike.
Samsung, SK Hynix and Micron dominate HBM supply and over 85% of global DRAM capacity; secondary vendors include Nanya and China’s CXMT, the world’s fourth-largest DRAM maker. Yet both CXMT and Huawei appear on U.S. entity lists, barred from advanced American semiconductor manufacturing equipment, limiting CXMT to less mature DRAM processes compared to the three top memory giants.
China’s multi-year national tech self-sufficiency policy backs CXMT and Huawei’s push to develop advanced DRAM manufacturing and ramp output. CXMT targets domestic and overseas chip sales, with Apple reportedly in supply talks for its memory products.
In-house DRAM production would let Huawei supply its own processors, storage, SSD controllers, smartphones, wearables and networking hardware, alongside its broader semiconductor component needs.
Jukan states Huawei operates DRAM fabs via a SwaySure joint venture, alongside other chip production lines, and controls at least 11 semiconductor facilities across China:
-Qingdao Si'En (5 IoT chip fabs, Qingdao)
- -DGGMT (Dongguan)
- -Fujian Jinhua (JHICC, Fujian)
- -Shenzhen Pensun Technology (PST, formerly Pengxinshu, 2 mobile chip fabs)
- -Pengxinwei (PXW, 2 fabs)
- -SwaySure (SWX, up to 3 DRAM fabs)
- -Fujian Hi-Tech (PJHT)
Industry insiders note these firms are state-backed, with Huawei acting as the de facto operator.
SWX specializes in DRAM; its former Chief Strategy Officer Yukio Sakamoto previously served as a TSMC fab director and president of Japan’s defunct Elpida Memory (later acquired by Micron). Sakamoto passed away from heart disease in February 2024 at age 76. Upon hiring him, SWX announced plans for data center, mobile DRAM R&D split across China and Japan.
Nystedt reports Huawei and SwaySure are building a large Shenzhen DRAM complex with 140,000 monthly 12-inch wafer capacity for 28nm DRAM production. A widely circulated X document confirms SWX, formally Shenzhen Yiweixu Technology, registered in March 2022 in Shenzhen Longhua, is building a 12-inch 28nm fab targeting 140k monthly wafers focused on DRAM output. Nystedt adds Huawei’s key equipment partner is domestic toolmaker SiCarrier.
Huawei holds established market positions in telecom, servers, storage, mobile and wearables. Vertical integration via self-produced DRAM and other semiconductors would shield it from U.S. tech curbs, external supply crunches and memory price volatility. The outlet has reached out to Huawei for official comment and will update coverage with any response.
Footnote
Qingdao Si'En and DGGMT fall under local municipal SASAC bodies; PST, PXW and SWX are fully owned by Shenzhen Major Industry Investment Group (SZMII), a Shenzhen SASAC entity Bloomberg confirmed in 2023 was created to fund Huawei’s semiconductor development.
Beijing Qianxing Jietong Technology Co., Ltd.
Sandy Yang/Global Strategy Director
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